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BAE Systems Mechanical Engineering Intern - Microelectronics Packaging in Cedar Rapids, Iowa

Job Description

BAE Systems is looking for a Mechanical Engineering Intern with a passion for engineering and the desire to learn about the world of Microelectronics.Our team needs engineers interested in designing and developing the Microelectronic Packages needed forGlobal Positioning Systems(GPS) products.This position offers abundant opportunity to acquire in-depth knowledge of Microelectronics Packagingand to apply that knowledge in a team effort.

As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle, including design, process development, qualification and factory support. Assignments may include tasks such as creating fixtures, supporting microelectronic prototype builds, failure analysis, and design support.The successfulapplicant should be knowledgeable and skilled with drafting software and enjoy hands on work.

Please note that pursuant to a government contract, this specific position requires US citizenship status.

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Required Education, Experience, & Skills

  • US Citizenship

  • Applicant must be pursuing a STEM degree in an applicable engineering or science field

Preferred Education, Experience, & Skills

  • Strong verbal and written technical communication skills

  • Ability to work with a diverse team

  • A genuine desire to learn and innovate

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Mechanical Engineering Intern - Microelectronics Packaging

64249BR

EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression

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